Hosted by the Research Institute for Soft Matter and Biomimetics, the International Workshop 2018 on Soft Matter will be hold in the Xiamen International Exhibition& Conference Center during Nov. 03-04. As the forum will provide a platform for people from different fields to exchange idea across the disciplines of soft matter research and engineering, anyone who is interested will be most welcome.


    For those who wish to attend, please see the REGISTRATION label on the right coner of the web and send an email including the registration information to

Abstract Submission

    There will be a number of keynote/invited presentations (by invitation), and confirmed speakers are listed at the SPEAKERS label. (For more information concerning the program and keynote/invited presentations, contact: A/Prof. Meidan Ye( )


   Poster presentations are open for submission from Aug. 1st to Sept. 25th, 2018. Please send the abstract to


   The template of abstract: Template_Abstract.doc.



  • Deadline for abstract submission is Sept. 25th, 2018.
  • Poster Information: The poster size: (70-90)cm×(110-130)cm.



About the forum

    Nowdays our life can be transferred to a completely new stage due to the booming of some areas of technologies. As one improtant research in soft matter field, flexible electronics is emerging as the next ubiquitous platform for the electronics industry. Flexible electronics based on soft functional materials start to play an increasingly important role in biomedical applications, wearable devices. Bio-flexible materials offer exquisite mechanical, optical, and electrical properties which are advantageous toward the development of next-generation biocompatible electronic devices. It is expected that the flexible devices are going to take over a trillion-dollar market in the years to come. On the other hand, advances in the information and communication technologies have led to the emergence of Internet of Thing (IoT). IoT allows many physical devices to capture transmit data, through the internet, providing more data interoperability methods. Internet of things (IoT) provides a platform that allows devices to be inter-connected, sensed and controlled remotely across a network infrastructure. Nowadays IoT plays an important role not only in communication, but also in monitoring, recording, storage and display. As a most rapid expanding and influencing area of research and applications, big data, the technologies utilized to refer to the increase in the volume of data that are difficult to store, process, and analyze through traditional database technologies, are changing the boarder of our living activities. Evidentially, the combination of the three technologies is re-shaping healthcare, science, engineering, finance, business, and eventually, the society.

    This conference aims to offer a world’s preeminent forum for reporting methodological and technological breakthroughs in the areas of flexible electronics, IoT, big data and cloud computing platforms, which could empower the multidisciplinary cooperation across the three areas, and look into the future perspective and impacts to our life and society.

Topics of the Forum

The forum will cover in the following subjects:

  • Flexible materials of functionalization and fabrication
  • Flexible electronics
  • Flexible sensors
  • Flexible energy devices
  • Flexible displays
  • Flexible transient devices
  • Internet of things
  • Big data
  • Cloud computing platforms

Important Date

Early Bird Registration:
Oct. 1th, 2018
Abstract Deadline:

Sept. 25th, 2018

Poster Deadline:

Sept. 25th, 2018

Contact US

Address: Physics Building, College of Physical Science and Technology, Haiyun Campus (Near Hulishan Fortress), Xiamen University, Zengcuoan West Road, Siming District, Xiamen City, China.

Postcode: 361005

Tel: 0592-2182775

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